Thermoelectric module for low temperature applications

Sangeeta Lal, Sim Loo, Duck Young Chung, Theodora Kyratsi, Mercouri G. Kanatzidis, Charles Cauchy, Timothy P. Hogan

Research output: Contribution to journalArticle

5 Scopus citations

Abstract

The possibility of a prototype thermoelectric cooling device for operation near liquid nitrogen temperatures has been explored. In these devices, the figure of merit involves a combination of the properties of the two branches of the module. Here, we investigate the fabrication of a module with a new low temperature material, CsBi4Te6 (p-type), and the best known low temperature n-type materials Bi85Sb15. Transport measurements for each of these materials show high performance at low temperatures. Known values for the figure of merit Zmax of CsBi4Te6 3.5 × 10-3 K-1 at 225K and for Bi85Sb15 is 6.5 × 10-3; K-1 at 77K. At 100K these values drop to 2.0 × 10-3 K-1 for CsBi4Te6 and 6.0 × 10-3 K-1 for Bi85Sb15. Theoretical simulations based on these data show a cooling of ΔT = 12K at 100K, which is almost three times the efficiency of a Bi2Te3 module at that temperature. We present transport measurements of elements used in the fabrication of a low temperature thermoelectric module and properties of the resulting module.

Original languageEnglish (US)
Pages (from-to)121-129
Number of pages9
JournalMaterials Research Society Symposium - Proceedings
Volume691
StatePublished - Jan 1 2002

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Lal, S., Loo, S., Chung, D. Y., Kyratsi, T., Kanatzidis, M. G., Cauchy, C., & Hogan, T. P. (2002). Thermoelectric module for low temperature applications. Materials Research Society Symposium - Proceedings, 691, 121-129.