Thermomechanicai behavior of multilayer structures in microelectronics

I. M. Daniel; T. M. Wang; J. T. Gotro

doi:10.1115/1.2904332

Thermomechanicai behavior of multilayer structures in microelectronics

I. M. Daniel, T. M. Wang, J. T. Gotro

Civil and Environmental Engineering

Research output: Contribution to journal › Article

36 Scopus citations

Abstract

Linear thermoelastk lamination theory was used to determine the state of residual stresses and warpage in multilayer structures following elevated temperature curing. The inputs necessary are the mechanical and thermal properties of each layer, the stacking sequence of layers, and the irreversible chemical deformation taking place during curing of the polymeric matrix layers. The predictions were verified experimentally with a woven-glass/epoxy material. The basic mechanical and thermal properties and polymerization shrinkage were determined for the unidirectional layer. Subsequently, the warpage was measured for a [06/906] antisymmetric crossply laminate by means of the shadow moire' method. Experimental results were in good agreement with the theoretical prediction.

Original language	English (US)
Pages (from-to)	11-15
Number of pages	5
Journal	Journal of Electronic Packaging, Transactions of the ASME
Volume	112
Issue number	1
DOIs	https://doi.org/10.1115/1.2904332
State	Published - Mar 1990

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Mechanics of Materials
Computer Science Applications
Electrical and Electronic Engineering

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Daniel, I. M., Wang, T. M., & Gotro, J. T. (1990). Thermomechanicai behavior of multilayer structures in microelectronics. Journal of Electronic Packaging, Transactions of the ASME, 112(1), 11-15. https://doi.org/10.1115/1.2904332

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