Thermomechanicai behavior of multilayer structures in microelectronics

I. M. Daniel, T. M. Wang, J. T. Gotro

Research output: Contribution to journalArticle

36 Scopus citations

Abstract

Linear thermoelastk lamination theory was used to determine the state of residual stresses and warpage in multilayer structures following elevated temperature curing. The inputs necessary are the mechanical and thermal properties of each layer, the stacking sequence of layers, and the irreversible chemical deformation taking place during curing of the polymeric matrix layers. The predictions were verified experimentally with a woven-glass/epoxy material. The basic mechanical and thermal properties and polymerization shrinkage were determined for the unidirectional layer. Subsequently, the warpage was measured for a [06/906] antisymmetric crossply laminate by means of the shadow moire' method. Experimental results were in good agreement with the theoretical prediction.

Original languageEnglish (US)
Pages (from-to)11-15
Number of pages5
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume112
Issue number1
DOIs
StatePublished - Mar 1990

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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