Thermomechanically induced voiding of Al-Cu thin films

Material Science

• Thin Films 100%
• Surface Diffusion 100%
• Residual Stress 100%
• Thermal Cycling 100%
• Electronic Circuit 100%
• Fracture Mechanics 100%
• Grain Boundary 100%
• Thermal Expansion 100%

INIS

• thin films 100%
• failures 100%
• testing 33%
• surfaces 33%
• comparative evaluations 33%
• reviews 33%
• prediction 33%
• diffusion 33%
• integrated circuits 33%
• grain boundaries 33%
• residual stresses 33%
• fracture mechanics 33%
• thermal cycling 33%
• thermal expansion 33%

Physics

• Thin Films 100%
• Failure 100%
• Fracture Mechanics 33%
• Integrated Circuit 33%
• Thermal Expansion 33%
• Grain Boundaries 33%