Thermoviscoelastic Analysis of Residual Stresses and Warpage in Composite Laminates

T. M. Wang, I. M. Daniel, J. T. Gotro

Research output: Contribution to journalArticlepeer-review

72 Scopus citations

Abstract

Linear thermoviscoelastic lamination theory was used to determine resid ual stresses and warpage in multidirectional woven-glass/epoxy laminates. The single “unidirectional” layer of the material was characterized by means of an accelerated procedure. The material was assumed to be thermorheologically simple and the time-temperature superposition principle (TTSP) was used to obtain “master curves” for the viscoelastic properties. A numerical procedure was developed for determination of residual stresses and warp age, taking into consideration the irreversible polymerization shrinkage and boundary conditions during curing. Warpage was measured experimentally for [06/906] and [011/30] laminates using the projection moire method and results were in good agreement with the analytical prediction.

Original languageEnglish (US)
Pages (from-to)883-899
Number of pages17
JournalJournal of Composite Materials
Volume26
Issue number6
DOIs
StatePublished - Jun 1992

Keywords

  • circuit boards
  • lamination theory
  • moire method
  • residual stresses
  • viscoelasticity
  • warpage

ASJC Scopus subject areas

  • Ceramics and Composites
  • Mechanics of Materials
  • Mechanical Engineering
  • Materials Chemistry

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