Abstract
Linear thermoviscoelastic lamination theory was used to determine resid ual stresses and warpage in multidirectional woven-glass/epoxy laminates. The single “unidirectional” layer of the material was characterized by means of an accelerated procedure. The material was assumed to be thermorheologically simple and the time-temperature superposition principle (TTSP) was used to obtain “master curves” for the viscoelastic properties. A numerical procedure was developed for determination of residual stresses and warp age, taking into consideration the irreversible polymerization shrinkage and boundary conditions during curing. Warpage was measured experimentally for [06/906] and [011/30] laminates using the projection moire method and results were in good agreement with the analytical prediction.
Original language | English (US) |
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Pages (from-to) | 883-899 |
Number of pages | 17 |
Journal | Journal of Composite Materials |
Volume | 26 |
Issue number | 6 |
DOIs | |
State | Published - Jun 1992 |
Keywords
- circuit boards
- lamination theory
- moire method
- residual stresses
- viscoelasticity
- warpage
ASJC Scopus subject areas
- Ceramics and Composites
- Mechanics of Materials
- Mechanical Engineering
- Materials Chemistry