Thin circular plate under temperature loading in adhesive contact with an elastic half-space

E. N. Mastrojannis; L. M. Keer; T. Mura

doi:10.1080/01495738708926996

Thin circular plate under temperature loading in adhesive contact with an elastic half-space

E. N. Mastrojannis^*, L. M. Keer, T. Mura

^*Corresponding author for this work

Civil and Environmental Engineering

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

The problem of adhesive contact between a thin circular plate under temperature loading and an isotropic elastic half-space is reduced to a problem of solving a pair of coupled integral equations for the unknown interfacial tractions. A numerical procedure for its solution is outlined and some results are presented in graphical form.

Original language	English (US)
Pages (from-to)	71-81
Number of pages	11
Journal	Journal of Thermal Stresses
Volume	10
Issue number	1
DOIs	https://doi.org/10.1080/01495738708926996
State	Published - 1987

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics

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10.1080/01495738708926996

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title = "Thin circular plate under temperature loading in adhesive contact with an elastic half-space",

abstract = "The problem of adhesive contact between a thin circular plate under temperature loading and an isotropic elastic half-space is reduced to a problem of solving a pair of coupled integral equations for the unknown interfacial tractions. A numerical procedure for its solution is outlined and some results are presented in graphical form.",

author = "Mastrojannis, {E. N.} and Keer, {L. M.} and T. Mura",

note = "Funding Information: This work was supported in part (L.M.K.) by the National Science Foundation under grant CEE-8315335 and in part (T.M.) by the U.S. Army Research Office under contract DAAG29-85-K-0134. One of the authors (E.N.M.) acknowledges support from the University of Patras, Patras, Greece.",

year = "1987",

doi = "10.1080/01495738708926996",

language = "English (US)",

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T1 - Thin circular plate under temperature loading in adhesive contact with an elastic half-space

AU - Mastrojannis, E. N.

AU - Keer, L. M.

AU - Mura, T.

N1 - Funding Information: This work was supported in part (L.M.K.) by the National Science Foundation under grant CEE-8315335 and in part (T.M.) by the U.S. Army Research Office under contract DAAG29-85-K-0134. One of the authors (E.N.M.) acknowledges support from the University of Patras, Patras, Greece.

PY - 1987

Y1 - 1987

N2 - The problem of adhesive contact between a thin circular plate under temperature loading and an isotropic elastic half-space is reduced to a problem of solving a pair of coupled integral equations for the unknown interfacial tractions. A numerical procedure for its solution is outlined and some results are presented in graphical form.

AB - The problem of adhesive contact between a thin circular plate under temperature loading and an isotropic elastic half-space is reduced to a problem of solving a pair of coupled integral equations for the unknown interfacial tractions. A numerical procedure for its solution is outlined and some results are presented in graphical form.

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ER -

Thin circular plate under temperature loading in adhesive contact with an elastic half-space

Abstract

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