Thin film interface stresses produced by high amplitude laser generated surface acoustic waves

Surface acoustic waves (SAWs) have been explored for nondestructive metrology of thin film elastic properties and thickness due to confinement of their energy within a shallow depth from a material surface. In this paper, we study the dynamic interfacial stresses produced by high amplitude SAWs generated by a strongly ablative source in a thin film-substrate system, with the goal of investigating the possibility of inducing thin film delamination at high loading rates. For modeling purposes, we represent the mechanical loading resulting from the pulsed laser-sample interaction in the ablative regime by an equivalent compressive surface load, and the resulting stresses and particle velocities induced by the generated SAWs are calculated using a linear finite element model. We explore the numerical model to study the dependence of the film-substrate interface tractions on the ratio of the film thickness and SAW wavelength for a soft film on a stiff substrate. Furthermore, by matching the numerical results obtained from the finite element model with experimental results, we are able to predict the dynamic interfacial stresses for a copper film on a fused silica substrate produced by SAWs excited by a high power pulsed laser line source. This study has implications for exploring SAWs in the characterization of interfacial failure in thin-film substrate systems.