Thor: Thermal-aware optimizations for extending reram lifetime

Majed Valad Beigi, Gokhan Memik

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations

Abstract

Resistive RAM (ReRAM) is an emerging memory technology that has been proposed as a promising alternative for DRAM-based main memory. In addition to being more scalable and non-volatile, ReRAM also has the capability of performing logic functions. In this paper, we aim to investigate using 3D stacked ReRAM to achieve a scalable and high-performance memory system architecture. 3D integration of ReRAM crossbar layers (i.e., 3D crossbar) is a potential method for further improving ReRAM density. However, 3D architectures typically suffer from high operating temperatures, which adversely impact ReRAM reliability and device performance. The objective of this study is to address ReRAM endurance limitations, which is a major drawback for such resistive memory technologies. Specifically, we analyze the impact of temperature on ReRAM endurance in 3D and 2.5D stacking designs and show that stacking ReRAM onto multicore dies (i.e., 3D stacking design) may cause lifetime concerns. We then propose a novel solution to improve the access efficiency and reduce the number of accesses to the overheated ReRAM banks. The goal of our mechanism which is mainly utilized for the 2.5D design, is to perform slower and fewer accesses to hot banks to cool them. Evaluation results show that our technique called THOR, can achieve 2.06× lifetime enhancement and 7.5°C peak temperature reduction over a baseline design with only 1.9% performance degradation while running on the 2.5D design.

Original languageEnglish (US)
Title of host publicationProceedings - 2018 IEEE 32nd International Parallel and Distributed Processing Symposium, IPDPS 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages670-679
Number of pages10
ISBN (Print)9781538643686
DOIs
StatePublished - Aug 3 2018
Event32nd IEEE International Parallel and Distributed Processing Symposium, IPDPS 2018 - Vancouver, Canada
Duration: May 21 2018May 25 2018

Publication series

NameProceedings - 2018 IEEE 32nd International Parallel and Distributed Processing Symposium, IPDPS 2018

Other

Other32nd IEEE International Parallel and Distributed Processing Symposium, IPDPS 2018
CountryCanada
CityVancouver
Period5/21/185/25/18

Keywords

  • 2.5D and 3D design
  • Endurance
  • ReRAM
  • Temperature

ASJC Scopus subject areas

  • Artificial Intelligence
  • Computer Networks and Communications
  • Hardware and Architecture
  • Information Systems and Management

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