Abstract
The three dimensional atom probe and field ion microscopy analysis of Co/ Pd multilayers for perpendicular media applications were discussed. A series of multilayer films, seeded with a Ti-based bilayer seed, were deposited on Si wafers. The atomic scale composition distribution was characterized using 3DAP and was used to characterize the structure of the films.
Original language | English (US) |
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Pages (from-to) | HA03 |
Journal | Digests of the Intermag Conference |
State | Published - Oct 1 2003 |
Event | Intermag 2003: International Magnetics Conference - Boston, MA, United States Duration: Mar 28 2003 → Apr 3 2003 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering