Three dimensional atom probe and field ion microscopy analysis of Co/Pd multilayers for perpendicular media applications

Y. Q. Ma*, A. K. Petford-Long, A. Cerezo, D. J. Larson, T. P. Nolan

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

Abstract

The three dimensional atom probe and field ion microscopy analysis of Co/ Pd multilayers for perpendicular media applications were discussed. A series of multilayer films, seeded with a Ti-based bilayer seed, were deposited on Si wafers. The atomic scale composition distribution was characterized using 3DAP and was used to characterize the structure of the films.

Original languageEnglish (US)
Pages (from-to)HA03
JournalDigests of the Intermag Conference
StatePublished - Oct 1 2003
EventIntermag 2003: International Magnetics Conference - Boston, MA, United States
Duration: Mar 28 2003Apr 3 2003

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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