Titanium-based thin film metallic glass as diffusion barrier layer for PbTe-based thermoelectric modules

Chia Chi Yu; Hsin jay Wu; Matthias T. Agne; Ian T. Witting; Ping Yuan Deng; G. Jeffrey Snyder; Jinn P. Chu

doi:10.1063/1.5046826

Titanium-based thin film metallic glass as diffusion barrier layer for PbTe-based thermoelectric modules

Chia Chi Yu, Hsin jay Wu^*, Matthias T. Agne, Ian T. Witting, Ping Yuan Deng, G. Jeffrey Snyder, Jinn P. Chu

^*Corresponding author for this work

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

17 Scopus citations

Abstract

The thin film metallic glass (TFMG) is an effective diffusion barrier layer for PbTe-based thermoelectric (TE) modules. Reaction couples structured with Cu/TFMG/PbTe are prepared via sputter-deposition and are annealed at 673 K for 8-96 h. The transmission line method is adopted for the assessment of electrical contact resistivity upon the PbTe/TFMG, and the value remains in the range of 3.3-2.5 × 10 ⁻⁹ (Ω m ² ). The titanium-based TFMG remains amorphous upon annealing at 673 K for 48 h and effectively blocks the inter-diffusion by not having grain-boundaries, which only allows the bulk diffusion between the metal electrode and the TE substrate.

Original language	English (US)
Article number	013001
Journal	APL Materials
Volume	7
Issue number	1
DOIs	https://doi.org/10.1063/1.5046826
State	Published - Jan 1 2019

Funding

This work was financially supported by the Applied Research Center for Thin-Film Metallic Glass from The Featured Areas Research Center Program within the framework of the Higher Education Sprout Project by the Ministry of Education (MOE) in Taiwan. H.J.W. acknowledges the financial support from the Young Scholar Fellowship Program by Ministry of Science and Technology (MOST) in Taiwan, under Grant No. MOST107-2636-E-110-001.

ASJC Scopus subject areas

General Materials Science
General Engineering

Access to Document

10.1063/1.5046826

Cite this

@article{b7c301703b464503abe2a68136da0935,

title = "Titanium-based thin film metallic glass as diffusion barrier layer for PbTe-based thermoelectric modules",

abstract = " The thin film metallic glass (TFMG) is an effective diffusion barrier layer for PbTe-based thermoelectric (TE) modules. Reaction couples structured with Cu/TFMG/PbTe are prepared via sputter-deposition and are annealed at 673 K for 8-96 h. The transmission line method is adopted for the assessment of electrical contact resistivity upon the PbTe/TFMG, and the value remains in the range of 3.3-2.5 × 10 −9 (Ω m 2 ). The titanium-based TFMG remains amorphous upon annealing at 673 K for 48 h and effectively blocks the inter-diffusion by not having grain-boundaries, which only allows the bulk diffusion between the metal electrode and the TE substrate.",

author = "Yu, {Chia Chi} and Wu, {Hsin jay} and Agne, {Matthias T.} and Witting, {Ian T.} and Deng, {Ping Yuan} and Snyder, {G. Jeffrey} and Chu, {Jinn P.}",

note = "Publisher Copyright: {\textcopyright} 2019 Author(s).",

year = "2019",

month = jan,

day = "1",

doi = "10.1063/1.5046826",

language = "English (US)",

volume = "7",

journal = "APL Materials",

issn = "2166-532X",

publisher = "American Institute of Physics",

number = "1",

}

TY - JOUR

T1 - Titanium-based thin film metallic glass as diffusion barrier layer for PbTe-based thermoelectric modules

AU - Yu, Chia Chi

AU - Wu, Hsin jay

AU - Agne, Matthias T.

AU - Witting, Ian T.

AU - Deng, Ping Yuan

AU - Snyder, G. Jeffrey

AU - Chu, Jinn P.

PY - 2019/1/1

Y1 - 2019/1/1

N2 - The thin film metallic glass (TFMG) is an effective diffusion barrier layer for PbTe-based thermoelectric (TE) modules. Reaction couples structured with Cu/TFMG/PbTe are prepared via sputter-deposition and are annealed at 673 K for 8-96 h. The transmission line method is adopted for the assessment of electrical contact resistivity upon the PbTe/TFMG, and the value remains in the range of 3.3-2.5 × 10 −9 (Ω m 2 ). The titanium-based TFMG remains amorphous upon annealing at 673 K for 48 h and effectively blocks the inter-diffusion by not having grain-boundaries, which only allows the bulk diffusion between the metal electrode and the TE substrate.

AB - The thin film metallic glass (TFMG) is an effective diffusion barrier layer for PbTe-based thermoelectric (TE) modules. Reaction couples structured with Cu/TFMG/PbTe are prepared via sputter-deposition and are annealed at 673 K for 8-96 h. The transmission line method is adopted for the assessment of electrical contact resistivity upon the PbTe/TFMG, and the value remains in the range of 3.3-2.5 × 10 −9 (Ω m 2 ). The titanium-based TFMG remains amorphous upon annealing at 673 K for 48 h and effectively blocks the inter-diffusion by not having grain-boundaries, which only allows the bulk diffusion between the metal electrode and the TE substrate.

UR - http://www.scopus.com/inward/record.url?scp=85060438127&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85060438127&partnerID=8YFLogxK

U2 - 10.1063/1.5046826

DO - 10.1063/1.5046826

M3 - Article

AN - SCOPUS:85060438127

SN - 2166-532X

VL - 7

JO - APL Materials

JF - APL Materials

IS - 1

M1 - 013001

ER -

Titanium-based thin film metallic glass as diffusion barrier layer for PbTe-based thermoelectric modules

Abstract

Funding

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this