TY - GEN
T1 - Transfer printed heterogeneous integrated circuits
AU - Menard, Etienne
AU - Bower, Christopher A.
AU - Carr, Joseph
AU - Rogers, John A.
N1 - Funding Information:
S. Q. Wu is very grateful to Dr. Jeff Zhao at Motomola Company for his long-term help. Thanks is also devoted to Prof. E. Takasugi at Osaka University for having sent their preprints. This work is supported in part by the NSFC in China.
PY - 2007
Y1 - 2007
N2 - We present a recently invented approach to combine broad classes of dissimilar materials into heterogeneously integrated (HGI) electronic systems with two or three dimensional (3D) layouts. We have developed a process, called transfer printing, to transfer high performance semiconductor materials such as silicon, gallium arsenide, gallium nitride, indium phosphide onto rigid or flexible substrates. One of the objectives of this approach is to enable the fine-scale integration of compound semiconductors (CS) with standard silicon-based integrated circuit technologies, eg. CMOS, to develop high performance HGI electronics systems on rigid or flexible substrates.
AB - We present a recently invented approach to combine broad classes of dissimilar materials into heterogeneously integrated (HGI) electronic systems with two or three dimensional (3D) layouts. We have developed a process, called transfer printing, to transfer high performance semiconductor materials such as silicon, gallium arsenide, gallium nitride, indium phosphide onto rigid or flexible substrates. One of the objectives of this approach is to enable the fine-scale integration of compound semiconductors (CS) with standard silicon-based integrated circuit technologies, eg. CMOS, to develop high performance HGI electronics systems on rigid or flexible substrates.
KW - Heterogeneous integration
KW - Micro-structured semiconductors
KW - Transfer printing
UR - http://www.scopus.com/inward/record.url?scp=77957005181&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77957005181&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:77957005181
SN - 1893580091
SN - 9781893580091
T3 - 2007 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007
SP - 203
EP - 205
BT - 2007 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007
T2 - 22nd International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007
Y2 - 14 May 2007 through 17 May 2007
ER -