Transfer printed heterogeneous integrated circuits

Etienne Menard; Christopher A. Bower; Joseph Carr; John A. Rogers

Transfer printed heterogeneous integrated circuits

Etienne Menard^*, Christopher A. Bower, Joseph Carr, John A. Rogers

^*Corresponding author for this work

Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Scopus citations

Abstract

We present a recently invented approach to combine broad classes of dissimilar materials into heterogeneously integrated (HGI) electronic systems with two or three dimensional (3D) layouts. We have developed a process, called transfer printing, to transfer high performance semiconductor materials such as silicon, gallium arsenide, gallium nitride, indium phosphide onto rigid or flexible substrates. One of the objectives of this approach is to enable the fine-scale integration of compound semiconductors (CS) with standard silicon-based integrated circuit technologies, eg. CMOS, to develop high performance HGI electronics systems on rigid or flexible substrates.

Original language	English (US)
Title of host publication	2007 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007
Pages	203-205
Number of pages	3
State	Published - Dec 1 2007
Event	22nd International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007 - Austin, TX, United States Duration: May 14 2007 → May 17 2007

Publication series

Name	2007 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007

Other

Other	22nd International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007
Country	United States
City	Austin, TX
Period	5/14/07 → 5/17/07

Keywords

Heterogeneous integration
Micro-structured semiconductors
Transfer printing

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

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Cite this

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title = "Transfer printed heterogeneous integrated circuits",

abstract = "We present a recently invented approach to combine broad classes of dissimilar materials into heterogeneously integrated (HGI) electronic systems with two or three dimensional (3D) layouts. We have developed a process, called transfer printing, to transfer high performance semiconductor materials such as silicon, gallium arsenide, gallium nitride, indium phosphide onto rigid or flexible substrates. One of the objectives of this approach is to enable the fine-scale integration of compound semiconductors (CS) with standard silicon-based integrated circuit technologies, eg. CMOS, to develop high performance HGI electronics systems on rigid or flexible substrates.",

keywords = "Heterogeneous integration, Micro-structured semiconductors, Transfer printing",

author = "Etienne Menard and Bower, {Christopher A.} and Joseph Carr and Rogers, {John A.}",

year = "2007",

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language = "English (US)",

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series = "2007 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007",

pages = "203--205",

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note = "22nd International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007 ; Conference date: 14-05-2007 Through 17-05-2007",

}

Menard, E, Bower, CA, Carr, J & Rogers, JA 2007, Transfer printed heterogeneous integrated circuits. in 2007 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007. 2007 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007, pp. 203-205, 22nd International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007, Austin, TX, United States, 5/14/07.

Transfer printed heterogeneous integrated circuits. / Menard, Etienne; Bower, Christopher A.; Carr, Joseph; Rogers, John A.

2007 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007. 2007. p. 203-205 (2007 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Transfer printed heterogeneous integrated circuits

AU - Menard, Etienne

AU - Bower, Christopher A.

AU - Carr, Joseph

AU - Rogers, John A.

PY - 2007/12/1

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N2 - We present a recently invented approach to combine broad classes of dissimilar materials into heterogeneously integrated (HGI) electronic systems with two or three dimensional (3D) layouts. We have developed a process, called transfer printing, to transfer high performance semiconductor materials such as silicon, gallium arsenide, gallium nitride, indium phosphide onto rigid or flexible substrates. One of the objectives of this approach is to enable the fine-scale integration of compound semiconductors (CS) with standard silicon-based integrated circuit technologies, eg. CMOS, to develop high performance HGI electronics systems on rigid or flexible substrates.

AB - We present a recently invented approach to combine broad classes of dissimilar materials into heterogeneously integrated (HGI) electronic systems with two or three dimensional (3D) layouts. We have developed a process, called transfer printing, to transfer high performance semiconductor materials such as silicon, gallium arsenide, gallium nitride, indium phosphide onto rigid or flexible substrates. One of the objectives of this approach is to enable the fine-scale integration of compound semiconductors (CS) with standard silicon-based integrated circuit technologies, eg. CMOS, to develop high performance HGI electronics systems on rigid or flexible substrates.

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KW - Micro-structured semiconductors

KW - Transfer printing

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BT - 2007 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007

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