Transfer printed heterogeneous integrated circuits

Etienne Menard*, Christopher A. Bower, Joseph Carr, John A. Rogers

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

We present a recently invented approach to combine broad classes of dissimilar materials into heterogeneously integrated (HGI) electronic systems with two or three dimensional (3D) layouts. We have developed a process, called transfer printing, to transfer high performance semiconductor materials such as silicon, gallium arsenide, gallium nitride, indium phosphide onto rigid or flexible substrates. One of the objectives of this approach is to enable the fine-scale integration of compound semiconductors (CS) with standard silicon-based integrated circuit technologies, eg. CMOS, to develop high performance HGI electronics systems on rigid or flexible substrates.

Original languageEnglish (US)
Title of host publication2007 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007
Pages203-205
Number of pages3
StatePublished - 2007
Event22nd International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007 - Austin, TX, United States
Duration: May 14 2007May 17 2007

Publication series

Name2007 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007

Other

Other22nd International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007
Country/TerritoryUnited States
CityAustin, TX
Period5/14/075/17/07

Keywords

  • Heterogeneous integration
  • Micro-structured semiconductors
  • Transfer printing

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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