Transfer printing by kinetic control of adhesion to an elastomeric stamp

Matthew A. Meitl*, Zheng Tao Zhu, Vipan Kumar, Keon Jae Lee, Xue Feng, Yonggang Y. Huang, Ilesanmi Adesida, Ralph G. Nuzzo, John A. Rogers

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1394 Scopus citations

Abstract

An increasing number of technologies require large-scale integration of disparate classes of separately fabricated objects into spatially organized, functional systems1-9. Here we introduce an approach for heterogeneous integration based on kinetically controlled switching between adhesion and release of solid objects to and from an elastomeric stamp. We describe the physics of soft adhesion that govern this process and demonstrate the method by printing objects with a wide range of sizes and shapes, made of single-crystal silicon and GaN, mica, highly ordered pyrolytic graphite, silica and pollen, onto a variety of substrates without specially designed surface chemistries or separate adhesive layers. Printed p-n junctions and photodiodes fixed directly on highly curved surfaces illustrate some unique device-level capabilities of this approach.

Original languageEnglish (US)
Pages (from-to)33-38
Number of pages6
JournalNature materials
Volume5
Issue number1
DOIs
StatePublished - Jan 2006

Funding

The authors thank A. Shim for helpful discussions, A. Jerez for help generating schematic cartoons, J. Rinne for supplying silica microspheres, J. Lyding for the use of his AFM, and C. J. Hubert for the use of her African Violets. This work was supported by DARPA-funded AFRL-managed Macroelectronics Program Contract FA8650-04-C-7101, the US Department of Energy under grant DEFG02-91-ER45439, the National Science Foundation under grant DMII-0328162, and a graduate fellowship from the Fannie and John Hertz Foundation. Correspondence and requests for materials should be addressed to J.A.R.

ASJC Scopus subject areas

  • General Chemistry
  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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