Abstract
Areas of application that span almost every class of microsystems technology, from electronics to energy storage devices to chemical/biochemical sensors, can benefit from options in engineering designs that exploit 3D micro/nanostructural layouts. Recently developed methods for forming such systems exploit stress release in prestretched elastomer substrates as a driving force for the assembly of 3D functional microdevices from 2D precursors, including those that rely on the most advanced functional materials and device designs. Here, concepts that expand the options in this class of methods are introduced, to include 1) component parts built with physically transient materials to allow triggered transformation of 3D structures into other shapes and 2) mechanical interlocking elements composed of female-type lugs and male-type hooks that activate during the assembly process to irreversibly “lock-in” the 3D shapes. Wireless electronic devices demonstrate the utility of these ideas in functional systems.
Original language | English (US) |
---|---|
Article number | 1903181 |
Journal | Advanced Functional Materials |
Volume | 29 |
Issue number | 40 |
DOIs | |
State | Published - Oct 1 2019 |
Funding
Y.P. and H.L. contributed equally to this work. The team acknowledges support from NSF (CMMI 1635443). Y.P. acknowledges the support from German Research Foundation (PA 3154/1-1). Y.Z. acknowledges the support from the National Natural Science Foundation of China (11672152 and 11722217) and the Tsinghua National Laboratory for Information Science and Technology. Y.H. acknowledges the support from the NSF (CMMI1400169 and CMMI1534120). This work utilized Northwestern University Micro/Nano Fabrication Facility (NUFAB), which is partially supported by Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource (NSF ECCS-1542205), the Materials Research Science and Engineering Center (DMR-1720139), the State of Illinois, and Northwestern University. Typographical errors within the main text and affiliations were corrected on October 4th, 2019 after initial online publication.
Keywords
- 3D mesostructure
- 4D structure
- freestanding
- microelectronics
- transformable
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- General Chemistry
- Biomaterials
- General Materials Science
- Condensed Matter Physics
- Electrochemistry