Transverse isotropic elastic moduli and in-plane thermal diffusivity in silicon-supported thin films of a photosensitive polyimide measured using impulsive stimulated thermal scattering

Jennifer K. Cocson, Christine S. Hau, Peijou M. Lee, Clara C. Poon, Annita H. Zhong, John A. Rogers, Keith A. Nelson*

*Corresponding author for this work

Research output: Contribution to journalArticle

14 Scopus citations

Abstract

Through impulsive stimulated thermal scattering, the elastic and thermal properties of silicon-supported thin films (2-11 μm thicknesses) of a new low-CTE (coefficient of thermal expansion) photosensitive polyimide based on a biphenyl dianhydride/p-phenylenediamine backbone were studied. The material was found to be mechanically anisotropic. The in-plane thermal diffusivity and the in-plane and through-plane shear and longitudinal sound speeds were determined.

Original languageEnglish (US)
Pages (from-to)4069-4075
Number of pages7
JournalPolymer
Volume36
Issue number21
DOIs
StatePublished - Jan 1 1995

Keywords

  • elastic/thermal properties
  • i.s.t.s. characterization
  • photosensitive thin film

ASJC Scopus subject areas

  • Organic Chemistry
  • Polymers and Plastics
  • Materials Chemistry

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