Abstract
Through impulsive stimulated thermal scattering, the elastic and thermal properties of silicon-supported thin films (2-11 μm thicknesses) of a new low-CTE (coefficient of thermal expansion) photosensitive polyimide based on a biphenyl dianhydride/p-phenylenediamine backbone were studied. The material was found to be mechanically anisotropic. The in-plane thermal diffusivity and the in-plane and through-plane shear and longitudinal sound speeds were determined.
Original language | English (US) |
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Pages (from-to) | 4069-4075 |
Number of pages | 7 |
Journal | Polymer |
Volume | 36 |
Issue number | 21 |
DOIs | |
State | Published - 1995 |
Funding
This work was supported in part by NSF Grant No. CHE-895 1738, which provided initial equipment for an undergraduate picosecond laser spectroscopy laboratory, NSF Grant No. DMR-9317198, and the Donors of the Petroleum Research Fund, administered by the American Chemical Society. We wish to acknowledge full or partial donations of equipment from Tektronix, Coherent Laser, Con-Optics, Ante1 and Neslab. We thank Dr Wesley Schindel and Mr Mel Zussman at DuPont for providing samples.
Keywords
- elastic/thermal properties
- i.s.t.s. characterization
- photosensitive thin film
ASJC Scopus subject areas
- Organic Chemistry
- Polymers and Plastics
- Materials Chemistry