TY - GEN
T1 - Tubes, ribbons and wires for flexible electronics
AU - Sun, Yugang
AU - Rogers, John A.
PY - 2006
Y1 - 2006
N2 - Solution processable conductors, dielectrics and semiconductors represent enabling materials for electronic circuits that can be fabricated on plastic sheets by continuous, high speed printing techniques. It is generally believed that these types of systems, which can cover large areas, will be important for new applications in consumer electronics. This talk describes the operational aspects of flexible transistors and circuits that use printable semiconductors based on carbon nanotubes, and on ribbons and wires of single crystal silicon, gallium arsenide (GaAs), indium phosphide (InP) and gallium nitride (GaN). High mobilities, optical transparency, GHz switching speeds and mechanical bendability and even stretchability represent a few of the unusual characteristics that can be achieved in these systems. These and other aspects, including the soft lithographic printing techniques used to form the devices and some costing studies for the materials and patterning methods will be discussed.
AB - Solution processable conductors, dielectrics and semiconductors represent enabling materials for electronic circuits that can be fabricated on plastic sheets by continuous, high speed printing techniques. It is generally believed that these types of systems, which can cover large areas, will be important for new applications in consumer electronics. This talk describes the operational aspects of flexible transistors and circuits that use printable semiconductors based on carbon nanotubes, and on ribbons and wires of single crystal silicon, gallium arsenide (GaAs), indium phosphide (InP) and gallium nitride (GaN). High mobilities, optical transparency, GHz switching speeds and mechanical bendability and even stretchability represent a few of the unusual characteristics that can be achieved in these systems. These and other aspects, including the soft lithographic printing techniques used to form the devices and some costing studies for the materials and patterning methods will be discussed.
UR - http://www.scopus.com/inward/record.url?scp=34250318961&partnerID=8YFLogxK
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U2 - 10.1109/VTSA.2006.251072
DO - 10.1109/VTSA.2006.251072
M3 - Conference contribution
AN - SCOPUS:34250318961
SN - 142440181X
SN - 9781424401819
T3 - International Symposium on VLSI Technology, Systems, and Applications, Proceedings
SP - 72
EP - 73
BT - 2006 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA - Proceedings of Technical Papers
T2 - 2006 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA
Y2 - 24 April 2006 through 26 April 2006
ER -