Twin stability in highly nanotwinned Cu under compression, torsion and tension

A. M. Hodge*, T. A. Furnish, C. J. Shute, Y. Liao, X. Huang, C. S. Hong, Y. T. Zhu, T. W. Barbee, J. R. Weertman

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

57 Scopus citations

Abstract

Twin stability under four distinct mechanical loading states has been investigated for highly nanotwinned Cu containing parallel nanotwins ∼40 nm thick. Observed deformation-induced microstructural changes under tension, compression, tension-tension fatigue and torsion are qualitatively compared in order to assess twin stability as a function of the loading direction and stress. It is observed that the twins are very stable although small microstructural changes vary with deformation mode. Shear bands, deformation-induced grain growth and detwinning are also discussed.

Original languageEnglish (US)
Pages (from-to)872-877
Number of pages6
JournalScripta Materialia
Volume66
Issue number11
DOIs
StatePublished - Jun 2012

Keywords

  • Copper
  • Nanostructure
  • Nanotwinned
  • Plastic deformation

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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