Ultrasonic characterization of the mechanical properties of thin films & coatings

Sridhar Krishnaswamy*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

This paper presents a review of recent work at Northwestern University in the area of ultrasonic characterization of thin film material properties. Contact and non-contact ultrasonic methods that are used to characterize the mechanical properties of micro-And nano-structured thin films are briefly described. Specifically, the methods used are: Line-focus Acoustic Microscopy, narrowband and broadband Photoacoustic guided wave methods, and Photoacoustic bulk-wave pump-probe techniques. Applications to several free-standing thin-films and thin-film on substrate systems are discussed.

Original languageEnglish (US)
Title of host publicationIUTAM Symposium on Recent Advances of Acoustic Waves in Solids - Proceedings of the IUTAM Symposium on Recent Advances of Acoustic Waves in Solids
EditorsTsung-Tsong Wu, Chien-Ching Ma
PublisherSpringer Verlag
Pages77-86
Number of pages10
ISBN (Print)9789048198924
DOIs
StatePublished - Jan 1 2010
EventIUTAM Symposium on Recent Advances of Acoustic Waves in Solids, 2009 - Taipei, Taiwan, Province of China
Duration: May 25 2009May 28 2009

Publication series

NameIUTAM Bookseries
Volume26
ISSN (Print)1875-3507

Other

OtherIUTAM Symposium on Recent Advances of Acoustic Waves in Solids, 2009
CountryTaiwan, Province of China
CityTaipei
Period5/25/095/28/09

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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