VCSEL bonding to silicon and plastic substrates

Hyejin Jeong*, Joshua D. Sulkin, Rak Hwan Kim, John A. Rogers, Kent D. Choquette

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Vertical cavity surface emitting lasers (VCSELs) are important light sources for communication and sensing applications. The materials used for fabricating VCSEL emitting at 650-1000 nm are typically limited to GaAs-based compounds. Increasingly III-V semiconductor photonic devices have been bonded to Si [1] and other substrates [2]. To extend the applications of VCSELs, we demonstrate a bonding approach [3] for VCSEL transfer onto foreign substrates. Our transfer process incorporates fully fabricated VCSEL arrays which do not require additional processing after bonding and optical characteristics are maintained after bonding. In this work, we demonstrate transfer of VCSEL arrays onto silicon and flexible plastic substrates.

Original languageEnglish (US)
Title of host publication2012 IEEE Photonics Conference, IPC 2012
Pages187-188
Number of pages2
DOIs
StatePublished - Dec 1 2012
Event25th IEEE Photonics Conference, IPC 2012 - Burlingame, CA, United States
Duration: Sep 23 2012Sep 27 2012

Publication series

Name2012 IEEE Photonics Conference, IPC 2012

Other

Other25th IEEE Photonics Conference, IPC 2012
CountryUnited States
CityBurlingame, CA
Period9/23/129/27/12

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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    Jeong, H., Sulkin, J. D., Kim, R. H., Rogers, J. A., & Choquette, K. D. (2012). VCSEL bonding to silicon and plastic substrates. In 2012 IEEE Photonics Conference, IPC 2012 (pp. 187-188). [6358553] (2012 IEEE Photonics Conference, IPC 2012). https://doi.org/10.1109/IPCon.2012.6358553