Abstract
In this paper we demonstrate a three-dimensional (3D) photonic integration scheme based on crystalline silicon. We develop a process using SU-8 based adhesive bonding to fabricate vertically stacked, double-layer silicon nanomembranes. A single-layer silicon photonic integrated circuit fabricated on a silicon-on-insulator (SOI) chip and a bare SOI chip are bonded together, followed by removal of the bare SOI chip's silicon substrate and buried oxide layer, to form a silicon nanomembrane as a platform for additional photonic layer. We designed and fabricated subwavelength nanostructure based fiber-to-chip grating coupler on the bonded silicon nanomembrane, and also inter-layer grating coupler for coupling between two silicon nanomembranes. The fiber-to-chip grating coupler has a peak efficiency of -3.9 dB at 1545 nm operating wavelength with transverse-electric (TE) polarization. The inter-layer grating coupler has a peak efficiency of -6.8 dB at 1533 nm operating wavelength with TE polarization. The demonstrated approach serves as a potential solution for 3D photonic integration and novel 3D photonic devices.
Original language | English (US) |
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Title of host publication | Optoelectronic Interconnects XIII |
Volume | 8630 |
DOIs | |
State | Published - Jun 24 2013 |
Event | Optoelectronic Interconnects XIII - San Francisco, CA, United States Duration: Feb 3 2013 → Feb 6 2013 |
Other
Other | Optoelectronic Interconnects XIII |
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Country/Territory | United States |
City | San Francisco, CA |
Period | 2/3/13 → 2/6/13 |
Keywords
- Adhesive bonding
- Grating Coupler
- Multi-layer
- Optical Interconnects
- Silicon Photonics
- Subwavelength Nanostructure
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering