Vertically Integrated Double-layer on-chip crystalline silicon nanomembranes based on adhesive bonding

Yang Zhang*, David Kwong, Xiaochuan Xu, Amir Hosseini, Sang Y. Yang, John A. Rogers, Ray T. Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper we demonstrate a three-dimensional (3D) photonic integration scheme based on crystalline silicon. We develop a process using SU-8 based adhesive bonding to fabricate vertically stacked, double-layer silicon nanomembranes. A single-layer silicon photonic integrated circuit fabricated on a silicon-on-insulator (SOI) chip and a bare SOI chip are bonded together, followed by removal of the bare SOI chip's silicon substrate and buried oxide layer, to form a silicon nanomembrane as a platform for additional photonic layer. We designed and fabricated subwavelength nanostructure based fiber-to-chip grating coupler on the bonded silicon nanomembrane, and also inter-layer grating coupler for coupling between two silicon nanomembranes. The fiber-to-chip grating coupler has a peak efficiency of -3.9 dB at 1545 nm operating wavelength with transverse-electric (TE) polarization. The inter-layer grating coupler has a peak efficiency of -6.8 dB at 1533 nm operating wavelength with TE polarization. The demonstrated approach serves as a potential solution for 3D photonic integration and novel 3D photonic devices.

Original languageEnglish (US)
Title of host publicationOptoelectronic Interconnects XIII
Volume8630
DOIs
StatePublished - Jun 24 2013
EventOptoelectronic Interconnects XIII - San Francisco, CA, United States
Duration: Feb 3 2013Feb 6 2013

Other

OtherOptoelectronic Interconnects XIII
CountryUnited States
CitySan Francisco, CA
Period2/3/132/6/13

Keywords

  • Adhesive bonding
  • Grating Coupler
  • Multi-layer
  • Optical Interconnects
  • Silicon Photonics
  • Subwavelength Nanostructure

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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