Wafer bonding technique for fabricating 1.5-um InGaAs/InGaAsP pillar-free microdisk lasers

Sheng Li Wu*, Lijun Wang, Jianping Zhang, Liwei Wang, Seng Tiong Ho

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new wafer bonding-etching technique has been developed successfully for micro-disk laser fabrication. Pillar-free micro-disk lasers have been realized. The micro-disk is placed on low refractive index material such as SiO 2 and surrounded by SiO 2 and air. The pillar-free micro-disk laser shows more solid than the pillar-supported micro-disk lasers. It has similar threshold pump power compared with the pillar-supported micro-disk lasers.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsSiamak Forouhar, Qiming Wang
Pages284-286
Number of pages3
StatePublished - 1996
EventSemiconductor Lasers II - Beijing, China
Duration: Nov 6 1996Nov 7 1996

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume2886

Other

OtherSemiconductor Lasers II
CityBeijing, China
Period11/6/9611/7/96

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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