Wafer bonding technique for fabricating 1.5-um InGaAs/InGaAsP pillar-free microdisk lasers

Sheng Li Wu*, Lijun Wang, Jianping Zhang, Liwei Wang, Seng Tiong Ho

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Keyphrases

Engineering

Material Science