Wear-contact problems and modeling of chemical mechanical polishing

O. G. Chekina*, L. M. Keer, H. Liang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

124 Scopus citations


Wafer shape and contact pressure evolution during chemical mechanical polishing, and the characteristics of the steady-state regime are analyzed on the basis of approaches developed in contact mechanics. Nonplanarity caused by the geometrical nonuniformity (erosion) and by the presence of different material on the surface (recess) is considered. The possibility of the process optimization and the determination of system parameters based on the polished surface profiles is discussed.

Original languageEnglish (US)
Pages (from-to)2100-2106
Number of pages7
JournalJournal of the Electrochemical Society
Issue number6
StatePublished - Jun 1998

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry


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