High resolution widefield subsurface microscopy of integrated circuits (IC) is demonstrated by exploiting the intense focusing ability of the numerical aperture increasing lens (NAIL) technique. The proposed method is intended to provide instantaneous image acquisition over relatively large areas, in case the image is acquired with a conventional camera system. The study has demonstrated a lateral spatial resolution of 260 nm while imaging ICs from backside, and that the exceedingly NA realized by NAIL microscopy ensures very high resolution, even in a simple widefield microscope. The proposed technique offers a unique prospect for assisting failure analysis of ICs, and displays an impact on the analysis of modern ICs allowing nanoscale imaging.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Electrical and Electronic Engineering