Wireless, skin-interfaced sensors for compression therapy

Yoonseok Park, Kyeongha Kwon, Sung Soo Kwak, Da Som Yang, Jean Won Kwak, Haiwen Luan, Ted S. Chung, Keum San Chun, Jong Uk Kim, Hokyung Jang, Hanjun Ryu, Hyoyong Jeong, Sang Min Won, Youn J. Kang, Michael Zhang, David Pontes, Brianna R. Kampmeier, Seon Hee Seo, Jeffrey Zhao, Inhwa JungYonggang Huang, Shuai Xu*, John A. Rogers*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

56 Scopus citations

Abstract

Therapeutic compression garments (TCGs) are key tools for the management of a wide range of vascular lower extremity conditions. Proper use of TCGs involves application of a minimum and consistent pressure across the lower extremities for extended periods of time. Slight changes in the characteristics of the fabric and the mechanical properties of the tissues lead to requirements for frequent measurements and corresponding adjustments of the applied pressure. Existing sensors are not sufficiently small, thin, or flexible for practical use in this context, and they also demand cumbersome, hard-wired interfaces for data acquisition. Here, we introduce a flexible, wireless monitoring system for tracking both temperature and pressure at the interface between the skin and the TCGs. Detailed studies of the materials and engineering aspects of these devices, together with clinical pilot trials on a range of patients with different pathologies, establish the technical foundations and measurement capabilities.

Original languageEnglish (US)
Article numbereabe1655
JournalScience Advances
Volume6
Issue number49
DOIs
StatePublished - Dec 4 2020

Funding

The materials and engineering efforts were supported by the Querrey-Simpson Institute for Bioelectronics. This work made use of the NUFAB facility of Northwestern University’s NUANCE Center, which has received support from the Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource (NSF ECCS-1542205); the MRSEC program (NSF DMR-1720139) at the Materials Research Center; the International Institute for Nanotechnology (IIN); the Keck Foundation; and the State of Illinois, through the IIN. Y.P. acknowledges the support from the German Research Foundation, Germany (PA 3154/1-1). S.M.W. acknowledges the support from the MSIT(Ministry of Science and ICT) Korea, under the ICT Creative Consilience program (IITP-2020-0-01821) supervised by the IITP (Institute for Information & Communications Technology Planning & Evaluation). Y.H. acknowledges the support from the NSF, USA (CMMI1635443). S.X. and J.A.R. acknowledge the support from the NIH, USA (1R43AG059445-01).

ASJC Scopus subject areas

  • General

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