X-ray diffraction topography of deformation accompanying laser drilling of silicon

S. R. Stock*, M. Greenstein, J. M. Rigsbee

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

X-ray diffraction topography was used to study laser drilling of (001) silicon. Double crystal, Lang projection and section topography were used to characterize the deformation surrounding holes drilled with a Nd/YAG laser operated at various energy densities. Scanning electron microscopy showed significantly different hole wall morphologies, and the relationship between these structures and the resulting strain field was investigated. This preliminary study indicated the feasibility of using section topography to quantify and map the different components of strain around laser-drilled holes in silicon.

Original languageEnglish (US)
Pages (from-to)87-93
Number of pages7
JournalMaterials Letters
Volume7
Issue number3
DOIs
StatePublished - Sep 1988

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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