XPS study of tungsten and barrier film transition at various stages of chemical mechanical polishing endpoint and of surface compositions post-CMP cleaning

INIS

• barriers 100%
• films 66%
• peaks 66%
• surfaces 50%
• removal 50%
• xps 50%
• polishing 33%
• cleaning 33%
• probes 16%
• depth 16%
• ammonia 16%
• residues 16%
• tungsten 16%
• mechanical polishing 16%

Engineering

• Endpoint 66%
• Reflectance 33%
• Peak Time 33%
• Barrier Film 33%
• Stages 33%
• Surface Film 16%
• Film Surface 16%
• Removal Rate 16%
• Chemical Mechanical Polishing 16%
• Polishing 16%
• Tungsten 16%
• Surfaces 16%
• Determines 16%
• Cleaning 16%
• Calculates 16%